Gidel Proc10M FPGA Accelerator Board | Stratix 10 MX | Proc1C carrier with 4x QSFP28 | FMC daughterboard | HBM2

Gidel’s Proc10M module is designed to enable easy use and immediate accessibility to the powerful Intel Stratix 10 FPGA with HBM2 on-chip memory technology for both host and embedded systems.

The combination of the Proc10M’s large FPGA with 10X memory bandwidth and 1,600 Gb/s IO enables an unprecedented level of processing, system compactness and cost performance.

The Stratix10 MX offers 10X more DRAM and eSRAM bandwidth than discrete DDR4 and QDR memories. The powerful Proc10M opens the way to implement diverse innovations and high-end applications, including:

AI training leveraging 128GB density, HBM2s’ huge bandwidth, and the FPGA’s massive logic and DSP blocks.

High-end solutions can be produced within a remarkabley short time using the Proc10M module, its carrier boards, and Gidel’s powerful development suite, thus significantly accelerating time to market and improving ROI.

The Intel Stratix 10 MX 2100 FPGA with its large HBM2 memory is ultra-compact at 95mm x 110mm has the following technical features:

The Gidel Proc10M FPGA accelerator can be embodied as a customized carrier card, Gidel’s carrier card or half-length PCIe carrier board, or as an FPGA Mezzanine Card FMC daughter board. It is supported by the Gidel ProcWizard via a PCIe connection, and the developer environment, as follows:

Proc1C PCIe Carrier Board for the Proc10M

Gidel's Proc10M module, based on Intel's powerful Stratix l0 MX HBM FPGA, is designed for ultra-high-performance acquisition and real-time processing. The combination of HBM technology, which enables 10x more DRAM and eSRAM bandwidth, and 1600 Gb/s I/O bandwidth, offers tremendous application possibilities at unprecedented compactness and cost-performance.

Gidel offers a half-length PCIe carrier board for the Proc10M that can be used as an off-the-shelf solution, and as a reference for developing a custom carrier board to meet the target application's specifications. Gidel provides the board's design schematics and a design guide.

The PCIe Gen3 x16 Proc1C off-the-shelf carrier board has four QSFP28 ports, each capable of 100 Gb/s data transfer. There is a PHS connector for mounting daughterboards, and 19 x GPIO5 for peripheral system control. The PHS offers up to 128 Gb/s Rx/Tx allowing connection to 8x CoaXPress-12 cameras, for example.

The Gidel Proc1C carrier board uses only one of the three Proc10M connectors. The two additional connectors available on the Proc1C board can be used, per user design, for additional 800 Gb/s bandwidth, RDIMM interface, and many additional I/Os.

A daughterboard compliant with CoaXPress Version 2 CXP at 12.5 Gbps is available to function as an ultra-high-performance frame grabber and industrial machine vision and digital imaging processor card.

In addition, Gidel offers custom services for quick development of a carrier board according to your system requirements.

Product Data

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Gidel Proc10M with ultra-compact module Stratix 10 2100 MX HBM2 FPGA supporting 2,073,000 LEs and 7,920 18 x19 MAC.
Gidel Proc10M: large HBM2 FPGA with ultra-compact module.
Gidel Proc10 M accelerator diagram showing key hardware elements.
Hardware accelerator diagram: Gidel Proc10M.
Gidel Proc10M PCIe Proc1C Carrier Board is designed for ultra-high-performance acquisition and real-time processing.
Gidel Proc10M PCIe Carrier Board Proc1C supports: PCIe Gen.3 x16 host interface, 4 x QSFP28 for up to 400 Gb/s aggregated bandwidth, Gidel PHS connector for mounting daughterboards, and 19 x GPIOs for peripheral system control.